Apparatus, system and method for providing a conformable vacuum cup for an end effector

ABSTRACT

The disclosed embodiments are and include at least an apparatus, system and method for providing a vacuum grip for an end effector. The apparatus, system and method may include at least a vacuum draw eyelet connectively associated with a vacuum at a base portion thereof, and having a larger cross-sectional circumference at a topmost portion thereof than at the base portion; an extending cup foam portion including a receiving portion suitable for receiving therewithin the larger cross-sectional circumference of the topmost portion; and a wire clip having two legs inserted along a cross-sectional plane of the extending cup foam portion, the two legs being suitable to compress the receiving portion into frictional contact at two tangent points on a second cross-sectional circumference of the vacuum draw eyelet below the larger cross-sectional circumference.

CROSS REFERENCE TO RELATED APPLICATION

The present application is a continuation application of U.S.Non-Provisional application Ser. No. 15/380,783, filed Dec. 15, 2016,entitled APPARATUS, SYSTEM AND METHOD FOR PROVIDING A CONFORMABLE VACUUMCUP FOR AN END EFFECTOR.

FIELD OF THE DISCLOSURE

The present disclosure relates to the transfer of articles, such assemiconductor wafers, and more particularly relates to a conformablevacuum cup, such as may be used on an end effector for gripping suchwafers.

DESCRIPTION OF THE BACKGROUND

The use of robotics is well established as a manufacturing expedient,particularly in applications where human handling is inefficient and/orundesirable. One such circumstance is in the semiconductor arts, inwhich robotics are used to handle wafers during various wafer-processingsteps. Such process steps may include, by way of example, chemicalmechanical planarization (CMP), etching, deposition, passivation, andvarious other processes in which a sealed and/or “clean” environmentmust be maintained, such as to limit the likelihood of contamination andto ensure that various specific processing conditions are met.

Current practice in the semiconductor arts to robotically handle thesewafers often includes the use of an end effector operably attached tothe robotics, such as in order to load semiconductor wafers from aloading stack into the various processing ports that may correspond tothe aforementioned exemplary process steps. That is, the robotics areemployed to deploy the end effector to retrieve the wafer from aparticular port or stack, such as before and/or after processing in anassociated process chamber. The wafer may thus be shuttled by therobotics connectively associated with the end effector to subsequentports for additional processing. When the wafer processing stages arecomplete, the robotics may then return the processed semiconductor waferto a loading port, and may, again using the end effector, then retrievethe next wafer for processing by the system. It is typical that a stackof several semiconductor wafers is processed in this manner using theend effector during each process run.

Typical end effectors hold the wafer on its bottom side, such as usingbackside suction provided by, for example, vacuum draw eyelets on aportion of the end effector. These vacuum eyelets are generally multiplein number and are at the distal end portion of an end effector. Thisdistal end of the end effector may, by way of non-limiting example, havea forked shape, a spatula shape, and so on. It is these vacuum eyeletsthat seize each silicon wafer for robotic transfer betweensemi-conductor processes, wafer aligners, wafer cassettes, and so on.

In the known art, the distal portion of the end effector is typicallyflat with respect to the bearing arm that interfaces to the robotics andfrom which the distal end of the end effector extends. As such, it istypical that the vacuum eyelets that grip the silicon wafer to the endeffector are of a higher height profile, such as ¼ inch in height, fromthe plane provided by the distal portion of the end effector. In short,this high height profile provides sufficient space between the bottom ofthe wafer and the distal portion of the end effector so as to avoidcontact between the wafer and the end effector. Such contact isundesirable in that it may lead to wafer damage and/or contamination.

However, such high height profile vacuum eyelets typically draw verypoor vacuum, and further may not provide the desired effect ofprecluding contact between the wafer and the end effector, at least forwafers having warped profiles. Such warping may result either fromprocessing effects on the wafer or even be present in the pre-processedwafer. Moreover, the issue of wafer contact with the end effector may beexacerbated for large wafers in known embodiments, at least because thepoor vacuum often drawn by non-conformable vacuum cups causing greaterdifficulty in gripping a large wafer, and this poor gripping may causethe wafer to move or drop during transport by the robot. Accordingly,there is a need for a vacuum cup for use with end effectors thatprovides improved vacuum and that better protects a semiconductor waferassociated with the end effector from dropping due to insufficientvacuum grip.

SUMMARY

The disclosed embodiments are and include at least an apparatus, systemand method for providing a vacuum grip for an end effector. Theapparatus, system and method may include at least a vacuum draw eyeletconnectively associated with a vacuum at a base portion thereof, andhaving a larger cross-sectional circumference at a topmost portionthereof than at the base portion; an extending cup foam portionincluding a receiving portion suitable for receiving therewithin thelarger cross-sectional circumference of the topmost portion; and a wireclip having two legs inserted along a cross-sectional plane of theextending cup foam portion, the two legs being suitable to compress thereceiving portion into frictional contact at two tangent points on asecond cross-sectional circumference of the vacuum draw eyelet below thelarger cross-sectional circumference.

The vacuum draw eyelet in combination with the extending cup foamportion may have a total height in a range of 1 mm to 5 mm, and moreparticularly may have a height of about 2 mm. The embodiments mayinclude a second wire clip having two legs inserted substantially alongthe cross-sectional plane, and having second two legs substantiallyperpendicular to the two legs of the first wire clip and being suitableto compress the receiving portion into frictional contact at third andfourth tangent points on the second cross-sectional circumference of thevacuum draw eyelet.

Certain of the embodiments may additionally include an end effector. Theend effector may include at least a bearing arm; an intermediate portionconnected on a first end to the bearing arm; and a distal end connectedto the intermediate portion on a second end of the intermediate portion.The distal end may include at least one vacuum draw eyelet connectivelyassociated with a vacuum at a base portion thereof, and having a largercross-sectional circumference at a topmost portion thereof than at thebase portion; an extending cup foam portion including a receivingportion suitable for receiving therewithin the larger cross-sectionalcircumference of the topmost portion; and a wire clip comprising twolegs inserted along a cross-sectional plane of the extending cup foamportion, the two legs being suitable to compress the receiving portioninto frictional contact at two tangent points on a secondcross-sectional circumference of the vacuum draw eyelet below the largercross-sectional circumference. Thus, the embodiments provide at least avacuum cup for use with end effectors that provides improved vacuum andthat better protects a semiconductor wafer associated with the endeffector from dropping due to insufficient vacuum grip.

BRIEF DESCRIPTION OF THE DRAWINGS

The exemplary compositions, systems, and methods shall be describedhereinafter with reference to the attached drawings, which are given asnon-limiting examples only, in which:

FIG. 1 is an illustration of an exemplary end effector;

FIG. 2 illustrates an exemplary vacuum pad in association with a distalend of an end effector;

FIG. 3 illustrates an exemplary vacuum draw eyelet having an enlargedhead portion;

FIG. 4 illustrates an exemplary extending cup foam portion having a wireretaining clip;

FIG. 5 illustrates an exemplary u-shaped wire frame;

FIG. 6 illustrates a cross-section of an exemplary extending cup foamportion having a wire retaining clip;

FIG. 7 illustrates a cross-section of an exemplary extending cup foamportion with a wire frame clip;

FIG. 8 is a profile illustration of an exemplary extending cup foamportion with a semi-conductor wafer thereon;

FIG. 9 illustrates two u-shaped wire frame clips mounted to a sub-plate;

FIG. 10 illustrates an exemplary u-shaped wire frame inserter; and

FIG. 11 is an illustration of an exemplary wire frame inserter.

DETAILED DESCRIPTION

The figures and descriptions provided herein may have been simplified toillustrate aspects that are relevant for a clear understanding of theherein described apparatuses, systems, and methods, while eliminating,for the purpose of clarity, other aspects that may be found in typicalsimilar devices, systems, and methods. Those of ordinary skill may thusrecognize that other elements and/or operations may be desirable and/ornecessary to implement the devices, systems, and methods describedherein. But because such elements and operations are known in the art,and because they do not facilitate a better understanding of the presentdisclosure, for the sake of brevity a discussion of such elements andoperations may not be provided herein. However, the present disclosureis deemed to nevertheless include all such elements, variations, andmodifications to the described aspects that would be known to those ofordinary skill in the art.

Embodiments are provided throughout so that this disclosure issufficiently thorough and fully conveys the scope of the disclosedembodiments to those who are skilled in the art. Numerous specificdetails are set forth, such as examples of specific components, devices,and methods, to provide a thorough understanding of embodiments of thepresent disclosure. Nevertheless, it will be apparent to those skilledin the art that certain specific disclosed details need not be employed,and that embodiments may be embodied in different forms. As such, thedisclosed embodiments should not be construed to limit the scope of thedisclosure. As referenced above, in some embodiments, well-knownprocesses, well-known device structures, and well-known technologies maynot be described in detail.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. For example, asused herein, the singular forms “a”, “an” and “the” may be intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. The terms “comprises,” “comprising,” “including,” and“having,” are inclusive and therefore specify the presence of statedfeatures, integers, steps, operations, elements, and/or components, butdo not preclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof. The steps, processes, and operations described herein are notto be construed as necessarily requiring their respective performance inthe particular order discussed or illustrated, unless specificallyidentified as a preferred or required order of performance. It is alsoto be understood that additional or alternative steps may be employed,in place of or in conjunction with the disclosed aspects.

When an element or layer is referred to as being “on”, “upon”,“connected to” or “coupled to” another element or layer, it may bedirectly on, upon, connected or coupled to the other element or layer,or intervening elements or layers may be present, unless clearlyindicated otherwise. In contrast, when an element or layer is referredto as being “directly on,” “directly upon”, “directly connected to” or“directly coupled to” another element or layer, there may be nointervening elements or layers present. Other words used to describe therelationship between elements should be interpreted in a like fashion(e.g., “between” versus “directly between,” “adjacent” versus “directlyadjacent,” etc.). Further, as used herein the term “and/or” includes anyand all combinations of one or more of the associated listed items.

Yet further, although the terms first, second, third, etc. may be usedherein to describe various elements, components, regions, layers and/orsections, these elements, components, regions, layers and/or sectionsshould not be limited by these terms. These terms may be only used todistinguish one element, component, region, layer or section fromanother element, component, region, layer or section. Thus, terms suchas “first,” “second,” and other numerical terms when used herein do notimply a sequence or order unless clearly indicated by the context. Thus,a first element, component, region, layer or section discussed belowcould be termed a second element, component, region, layer or sectionwithout departing from the teachings of the embodiments.

Thus, the disclosed embodiments provide a low profile vacuum cup thathas a conformable, circumferentially-extending cup portion, which may beformed of foam or sponge, such as a silicon-based foam preferably withESD properties. The extended vacuum cup may extend at least partiallyaround the circumference of a known vacuum draw eyelet that is typicallyassociated with an end effector.

This extending vacuum cup may have a wire clip therethrough to allow itto substantially frictionally engage around a known vacuum draw eyelet.The clip may be embedded within the foam such that the foam may bestretched over the upper circumference, or the “head,” of a known vacuumdraw eyelet, and once atop the head the wire clip may then “snap” aroundto frictionally compress a portion of the foam along an underside of thevacuum eyelet head having a circumference less than the largestcircumference of the upper head. This wire clip may be a “U shape” thatprovides parallel wire clips along two opposing tangent points of thecircumference of the vacuum draw eyelet head. Moreover, two u-shapedclips may be provided, thereby providing two parallel sets of wireclips, such as substantially perpendicularly to one another, thatfrictionally compress the foam against four tangent points of the vacuumdraw eyelet head. This retaining clip then re-conforms the foam once thefoam is stretched over the eyelet of the vacuum draw to allow theextended portion to substantially frictionally adhere over the eyeletportion.

Noting that a u-shaped clip is disclosed herein only by way ofnon-limiting example, the u-shape may conveniently provide parallelextending wire portions in order to enable the requisite dual-tangentpoint frictional contact after insertion into the foam extending cup,and may additionally provide a grasping element to readily enableinsertion, i.e., the base of the u-shape. For example, the u-shape mayallow for grasping of the base of the u-shape to insert the parallelwire portions, i.e., the “legs” of the u-shape, through the foam, andthe exposed portions of the legs portions after insertion may be bentover towards one another in order to provide a substantially rectangularfinal form of the initially u-shaped wire clip.

The pressure imparted on either side of the “donut hole” within theextending cup foam portion by the wire clip, and the self-sealing natureof the foam used to provide the extending cup, cause the foam tocompress about the vacuum draw eyelet head and to seal around the eyelethead and the wire, thereby preventing leakage of the vacuum draw when asilicon wafer comes into contact with the eyelet and its foam extendingcup. More particularly, the extending cup foam portion thus enhances thevacuum draw of the eyelet such that a higher height profile for thevacuum draw eyelet, such as is typically used in the known art, is notnecessary with certain of the disclosed embodiments. Moreover, theenhanced vacuum provided by certain of the embodiments better handlesirregular surfaces and large wafers than does the known art.

In a particular embodiment, the extending cup may be in the range of 1mm-5 mm, such as 2 mm, in height above the plane of a corresponding endeffector. Consequently, the height of the vacuum draw eyelet above theplane provided by the surface of the end effector need only be ofapproximately the same height as the extending cup. This stands incontrast to the known art, in which, as referenced above, the typicalheight of the vacuum eyelet draw is 7.5 mm, i.e., ¼ inch.

As referenced throughout, the extending cup may preferably be suitableto stretch and compress, at least in order to allow the extending cup tohave the donut hole thereof stretched over the vacuum eyelet head, andthen to allow the wire frame within the foam to compress the foam aboutthe eyelet in order to frictionally adhere the extending cup hole aboutthe vacuum eyelet. Yet further, it may be preferable that the foam isimmune to the buildup of electrical charge in order to best preventdamage to the silicon wafer or the devices created thereon, andconsequently the foam may at least partially be formed of silicon.

FIG. 1 illustrates an exemplary end effector 10 having associatedtherewith a vacuum grip. In the illustration, the bearing arm 12 hasassociated therewith certain electronic or electro-mechanical elements14 to allow for interoperation of the end effector with the robotics,and includes a cap 16 over said electronic and electro-mechanics.Further illustrated in FIG. 1 is a robotics flange 20 that allows forassociation of these electronics and electro-mechanics with a roboticarm or arms that actuate the end effector 10 such that it may movewafers between wafer processing steps.

Also shown in FIG. 1 is a fork distal end 22 of the end effector 10,which has associated therewith multiple, such as three as illustrated,vacuum pads 30 for receiving thereupon a silicon wafer. Of note, thedistal end 22 may be of any known shape, such as the fork illustrated ora spatula shape. Additionally visible in the embodiment of FIG. 1 is anintermediate portion 32 between the bearing arm 12 and the distal end 22of the end effector, wherein the exemplary intermediate portion 32includes one or more bends, curves, or angular portions 40 that serve toadditionally prevent contact by the underside of a silicon waferassociated with the vacuum pads 30 with the distal end 22, theintermediate portion 32, or the bearing arm 12.

The vacuum pads 30 of FIG. 1 include a vacuum draw eyelet receivingportion 50, i.e., a “donut hole,” which receives within its open innercircumference a vacuum draw eyelet 52. The vacuum eyelet 52 may be ofthe type found in the known art, such as may be formed of rubber,plastic, or the like. Extending from the eyelet receiving portion 50 toan outermost circumference 60 of vacuum pad 30 is an extending cup foamportion 62 that provides a second circumferential about the vacuum draweyelet 52. Although reference is made throughout to the extending cupfoam portion, those skilled in the art may appreciate that this featuremay be formed of any of a variety of materials, such as includingvarious types of foam.

FIG. 2 illustrates with greater particularity an exemplary vacuum pad 30in association with a distal end 22. As illustratively shown, the eyelet52 may circumferentially vary from the base thereof 52 a to the topmostportion, or “head” 52 b, thereof. This circumferential variation mayprovide a portion of the eyelet 52, such as just under the head 52 b,which a wire retaining clip 102 may frictionally engage in order to holdthe extending cup foam portion 62 over the eyelet 52.

Thus, as is evident in FIG. 2, the extending cup foam portion 62 may beof a substantially greater circumference than the circumference of thetopmost portion 52 a of the eyelet 52. Moreover, the wire frame 102 mayextend through the extending cup foam portion 62, such as substantiallymidway between the topmost portion of the extending cup foam portion 62and the bottommost portion of the extending cup foam portion 62. Thewire frame 102 may be composed of stainless steel, by way ofnon-limiting example.

FIG. 3 illustrates an exemplary eyelet 52 having an enlarged headportion 52 a in relation to a base circumference 52 b thereof. As shownin FIG. 3, a u-shaped wire frame 102 has been placed substantiallythrough the center of the extending cup foam portion 62, with conjoiningportion of the wire frame 102 between the wire legs 202 providing aconnective portion 204 which may be used to insert legs 202, and whereinthe exposed ends 206 of legs 202 have been bent over upon one anotherwhere those legs 202 protrude from the extending cup foam portion 62.Moreover, the legs 202 of the wire frame 102 illustratively engage justunder the head 52 a of eyelet 52. Accordingly, the u-shaped wire frame102 provides a clip that retains the extending cup foam portion 62 overthe vacuum draw eyelet 52.

FIG. 4 illustrates the extending cup foam portion 62 having a wireretaining clip 102 placed therethrough just prior to the association ofthe extending cup foam portion 62 with a typical vacuum draw eyelet 52having a varying circumference from the topmost portion 52 a to thebottommost portion 52 b thereof, and wherein the topmost portion 52 ahas a large top circumference to allow for retention of the wire clip102 thereunder. Thus, the wire clip 102 through the extending cup foamportion 62 can grip under the topmost portion 52 a of the eyelet 52after the sufficiently pliable receiving portion 50 has been stretchedover the topmost portion 52 a.

FIG. 5 illustrates an exemplary u-shaped wire frame 102 that may bepierced through a cross-sectional plane of the extending cup foamportion 62, in order to allow for operation of the retaining wire clip102 discussed throughout. As illustrated, the wire frame 102 may have au-shape, although other wire frames shapes and types may be provided.The wire legs 202 may be angled or pointed 502 at the tips 206 thereof,by way of non-limiting example, such as to allow for the wire frame 102to be readily pierced through the cross-section of the extending cupfoam portion 62. Needless to say, the perpendicular distance between thelegs 202 of the u-shaped wire frame 102 may be slightly smaller than thetopmost diameter of the vacuum draw eyelet 52 a, and/or approximatelyequal to the diameter of the eyelet 52 at the point on the eyelet 52 atwhich the wire frame 102 is to adhere to the eyelet 52, such that thewire clip will suitably maintain the extending cup foam portion 62 inplace on the eyelet, even when low level forces, such as a vacuum drawand/or placement of a wafer, are applied.

FIG. 6 illustrates a cross-section of an extending cup foam portion 62having a wire retaining clip 102 that is clipped just beneath thetopmost circumference 52 a of a vacuum draw eyelet 52. As illustrated,the wire retaining clip 102 may contract or substantially contract thecircumference extending cup foam portion 62 most substantially at twopoints in order to provide tangential friction at those two points onthe circumference of the vacuum draw eyelet 52. As such, it may bepreferred that these two points are on substantially opposing pointsalong a diameter of the vacuum draw eyelet 52.

FIG. 7 illustrates a cross-section of the physical association of anextending cup foam portion 62 with a wire frame 102 therethrough with avacuum draw eyelet 52 that is fastened via a fastener 602, such as viathreads, to the distal portion 22 of an end effector, and that has oneor more vacuum channels 604 leading to the base portion 52 b of thevacuum draw eyelet 52. The extending cup foam portion 62 may have aheight extending above the plane provided by the distal end 22 of theend effector of, by way of non-limiting example, 2 mm. Moreover, theextending cup foam portion 62 may be of a construction that is highlyconformable, such as to allow the inner circumference 50 of theextending cup foam portion 62 to be conformed over the topmostcircumference 52 a of the vacuum draw eyelet 52, after which the wireframe 102 may compress the inner circumference 50 of the extending cupfoam portion 62 such that the extending cup foam portion 62 is therebyretained about the vacuum draw eyelet 52.

Further, the conformable nature of the extending cup foam portion 62 mayallow for adaptability and improved vacuum to irregular surfaces on asemi-conductor wafer, process formations on a silicon wafer such assolder bumps or the like, and larger wafers. The foregoing are allembodiments in which the rigid vacuum eyelets of the known art provide apoor vacuum seal and substantially higher profile heights, which alsolead to poor vacuum and poor adaptability.

FIG. 8 provides a profile illustration of the association of theextending cup foam portion 62 physically with a semi-conductor wafer802. In the illustration, the open cell format of the extending cup foamportion 62 conforms and seals to the irregular, tilted, and bumpysurfaces provided by the silicon wafer 802.

FIG. 9 illustrates a certain embodiment in which two u-shaped wire frameclips 102 a, 102 b are provided as retaining clips. As will beunderstood by the skilled artisan, the addition of a second u-shapedwire clip 102 b having parallel extending legs 202 provides twoadditional tangential frictional contact points of the second wire frame102 b with eyelet 52. Thereby, four tangential frictional contact pointsin total, from the four legs 202 of wire frames 102 a, 102 b, provide anenhanced physical association of the extending cup foam portion 62 withthe vacuum draw eyelet 52.

FIG. 10 provides an exemplary embodiment of a u-shaped wire frameinserter 1002 for use with the disclosed wire frames 102 and extendingcup foam portion 62. In the illustration, the u-shaped wire frame 102may be inserted, with the legs 202 thereof facing towards the extendingcup foam portion 62, into cylinders 1003 of a slider brace 1004 that maybe slideably associated with a low friction slider 1006, such as at thebase of brace 1004. In short, the cylinders 1003 may be slid on brace1004 to pierce through the extending cup 62, so that the end of wirelegs 202 of wire clip frame 102 may be received into the cylinders 1003on the side of extending cup 62 opposite the sliding brace 1004.Further, the extending cup foam portion 62 may be placed on a chuck1010, such as may have a center holding portion 1012 extending upwardlyfrom the chuck 1010 that is approximately matched to the size of theinner circumference 50 of the extending cup foam portion 62, in order toeventually receive insertion of cylinders 1003 and wire legs 202.

FIG. 11 is a closer illustration of an exemplary wire frame inserter1002. As illustrated in FIG. 11, a locking plate 1102 may be insertedatop the extending cup foam portion 62 in order to lock the extendingcup foam portion 62 in position in relation to the chuck 1010. Moreover,at a portion of the chuck 1010 proximal to the sliding brace 1004 may beprovided a guide plate 1110, through which cylinders 1003 may be guidedto the proper cross-sectional plane of extending cup foam portion 62 atwhich wire legs 202 are to be received. Thereby, when the sliding brace1004 is pushed forward, the cylinders 1003 may go through the guideplate 1110 to allow for eventual insertion of wire legs 202 intocylinders 1003 at the desired height and position into the extending cupfoam portion 62. Once the legs 202 are fully inserted, the sliding brace1004 may be slid away to remove cylinders 1003, the wire legs 202 nowprotruding from the proximal arc (in relation to brace 1004) of theextending cup foam portion 62 may be bent over in order to complete theclip, the lock 1102 atop the chuck 1010 may be removed, and theextending cup foam portion 62 may be slid upwardly along the centerextension of the chuck 1010 for removal. Of course, those skilled in theart will appreciate that other insertion mechanisms for wire clip frame102 may be provided, and hence that the above-referenced inserter 1002is provided only by way of example.

As such, the extending cup foam portion provides enhanced sealing forimproved vacuum adhesion to rough surface geometries for semiconductorprocessing, such as solder bump surfaces, trenched wafers, grooved solarcells, large wafers having uneven warping, and the like. Moreover, theopen cell structure of, for example, conductive silicon foam, as may beused in the extending cup foam portion, readily compresses and seals asthe vacuum is applied, thereby enhancing the vacuum drawn by the vacuumdraw eyelet. Moreover, to the extent the topmost height profile providedby the extending cup foam portion is slightly higher than the topmostheight profile of the vacuum draw eyelet, the conformable top vacuumsurface readily conforms to tilted geometries and random surfaces, tothereby provide an improved seal to such surfaces as the extending cupfoam portion is compressed by the vacuum draw.

And as referenced, the insertion of the wire clip into and through theextending cup foam portion does not diminish the vacuum draw, in partbecause the extended foam portion is compliant and conforms about themetal clip in order to seal any vacuum leaks. This property of theextending cup foam portions similarly enhances the vacuum drawn by thevacuum draw eyelet over prior embodiments, as discussed above.

Further, the descriptions of the disclosure are provided to enable anyperson skilled in the art to make or use the disclosed embodiments.Various modifications to the disclosure will be readily apparent tothose skilled in the art, and the generic principles defined herein maybe applied to other variations without departing from the spirit orscope of the disclosure. Thus, the disclosure is not intended to belimited to the examples and designs described herein, but rather is tobe accorded the widest scope consistent with the principles and novelfeatures disclosed herein.

1-20. (canceled)
 21. A vacuum grip for an end effector, comprising: atleast one vacuum draw eyelet communicatively associated with a vacuum,and having a groove substantially circumferentially thereabout; anextending foam cup including a receiving inner circumference suitablefor receiving therein at least the groove; and a wire clip comprisingtwo legs inserted along a cross-sectional plane of the extending foamcup, the two legs being suitable to compress the receiving innercircumference into frictional contact with the groove.
 22. The vacuumgrip of claim 21, wherein the wire clip comprises stainless steel. 23.The vacuum grip of claim 21, wherein the extending foam cup is comprisedof silicon.
 24. The vacuum grip of claim 21, wherein the wire clipfurther comprises a leg-joining portion capable of receiving force toinsert the wire clip.
 25. The vacuum grip of claim 21, wherein the wireclip further comprises overlapped ends of the legs to close the wireclip at a distal point from the insertion.
 26. The vacuum grip of claim21, wherein the groove is substantially midway between a top plane and abottom plane of the vacuum draw eyelet.
 27. The vacuum grip of claim 21,wherein the vacuum draw eyelet comprises one of rubber and plastic. 28.The vacuum grip of claim 21, wherein the vacuum draw eyelet incombination with the extending foam cup has a total height in a range of1 mm to 5 mm.
 29. The vacuum grip of claim 28, wherein the total heightis about 2 mm.
 30. The vacuum grip of claim 21, further comprising asecond wire clip having a second two legs inserted to the groovesubstantially perpendicular to the two legs.
 31. The vacuum grip ofclaim 21, further comprising a distal end of the end effector to whichthe vacuum draw eyelet is mounted.
 32. The vacuum grip of claim 31,wherein the distal end comprises a fork distal end.
 33. The vacuum gripof claim 32, wherein the at least one vacuum draw eyelet comprises atleast three vacuum draw eyelets.
 34. The vacuum grip of claim 31,wherein the extending foam cup comprises an open cell format.
 35. An endeffector, comprising: a bearing arm; an intermediate portion connectedon a first end to the bearing arm; a distal end connected to theintermediate portion on a second end of the intermediate portion, andcomprising: at least one vacuum draw eyelet communicatively associatedwith a vacuum, and having a groove substantially circumferentiallythereabout; an extending foam cup including a receiving innercircumference suitable for receiving therein at least the groove; and awire clip comprising two legs inserted along a cross-sectional plane ofthe extending foam cup, the two legs being suitable to compress thereceiving inner circumference into frictional contact with the groove.36. The end effector of claim 35, wherein the intermediate portionincludes at least one angular portion.
 37. The end effector of claim 35,wherein the bearing arm comprises a robotic flange and electromechanicalelements to engage the robotic flange.
 38. The end effector of claim 35,wherein the groove is substantially midway between a top plane and abottom plane of the vacuum draw eyelet.
 39. The end effector of claim35, wherein the vacuum draw eyelet comprises one of rubber and plastic.40. The end effector of claim 35, wherein the vacuum draw eyelet incombination with the extending foam cup has a total height of about 2mm.